Effect of 2D photonic structure patterned in the LED surface on emission properties. - In: Applied surface science, Bd. 269 (2013), S. 161-165
http://dx.doi.org/10.1016/j.apsusc.2012.10.030
Sputtered TiO 2 thin films with NiO additives for hydrogen detection. - In: Applied surface science, Bd. 269 (2013), S. 110-115
http://dx.doi.org/10.1016/j.apsusc.2012.09.061
Sputtered ITO for application in thin-film silicon solar cells: relationship between structural and electrical properties. - In: Applied surface science, Bd. 269 (2013), S. 81-87
http://dx.doi.org/10.1016/j.apsusc.2012.10.180
Magnetic properties of multicore magnetite nanoparticles prepared by glass crystallisation. - In: Journal of materials science, ISSN 1573-4803, Bd. 48 (2013), 6, S. 2299-2307
http://dx.doi.org/10.1007/s10853-012-7009-7
Ordered arrays of nanoporous silicon nanopillars and silicon nanopillars with nanoporous shells. - In: Nanoscale research letters, ISSN 1556-276X, Bd. 8.2013, 1, Article 42, insges. 20 S.
https://doi.org/10.1186/1556-276X-8-42
Sputtered NiO thin films for organic vapours testing. - In: 2012 Ninth International Conference on Advanced Semiconductor Devices & Microsystems (ASDAM), ISBN 978-1-4673-1198-4, (2012), S. 291-294
http://dx.doi.org/10.1109/ASDAM.2012.6418540
Electrodeposition of Co and Co-Cu nanowires in porous alumina substrates by pulse and pulse reverse plating. - In: Symposium Anodisieren - vom Korrosionsschutz bis zur Nanotechnologie, (2012), S. 57-63
Bonding of ceramics using reactive NanoFoil®. - In: 4th Electronic System-Integration Technology Conference (ESTC), 2012, ISBN 978-1-4673-4645-0, (2012), insges. 4 S.
A new bonding technique with reactive NanoFoils® developed by Indium Corp. was presented recently. These 40 m thick foils consist of aluminum - nickel multilayers, which react in a short but extensive exothermal heat pulse after an ignition. Additionally, these foils are sometimes covered with 5 m tin layers on each side, in order to improve bonding results. The foils act as local heat source for the bonding process. The short reaction time reduces the thermal stress to the package, what offers the possibility to join materials with different thermal expansions. In an evolutionary approach the tensile strength of the bond was tested. Therefor alumina ceramics and low temperature co-fired ceramics (LTCC) with a silver-based metallization were bonded together. The NanoFoil® was activated by an electrical discharge. Also a LTCC package with integrated activation methods was build to make allowance for the fact, that the NanoFoils® are difficult to access during the bond process. Using NanoFoils® without tin layers resulted in micro cracks within the reacted foil. The additional tin layers melted and filled the micro cracks. The bond strength of the joints was tested with good results. Additionally, the thermal performance of the bonds was investigated. Therefore, a small thermal test chip with an integrated heater was bonded on a metalized alumina using NanoFoils® with tin layers. The generated heat was measured with IR spectroscopy. To compare the thermal performance with common die attach processes the test chip was also soldered and glued on the alumina carrier. It could be shown, that the bond had a good thermal performance, which was comparable to the performance of the classic bonds.
http://dx.doi.org/10.1109/ESTC.2012.6542143
Electrodeposition of Co-Cu nanowires in alumina templates. - In: Tagungsband zum Zweiten Workshop Oberflächentechnik, ISBN 978-3-938843-72-7, (2012), S. 20-24
Glimmentladungsanalyse (GD-OES) buntgehärteter Stahloberflächen. - In: Materials testing, ISSN 0025-5300, Bd. 54 (2012), 10, S. 707-712