Conference papers 2024
- Müller, J.; Kaltwasser, M.; Bartsch, H.; Behrens, A.; Handte, T.; Wüster, J.; Sinzinger, St.:
Glass and Glass/LTCC Interposers as Heterogenous Integration Platform
Pan Pacific Strategic Electronics Symposium (Pan Pacific), Kona, Big Island, HI, USA, 2024, pp. 1-7, doi: 10.23919/PanPacific60013.2024.10436523. - Beckert, E.; Jetter, M.; Müller, J.; Hein, M.; Spiess, Chr.; Chowdhury, S.; Schreiber, P.; Zeng, F.; Engel, L.; Zimmer, M.; Cutuk, A.; Supreeti, S.; Stehr, U.; Bartsch, H.; Kaltwasser, M.; Babin, M.:
Compact, high performant prepare-and-measure photon source based on indistinguishable VCSELs
Proceedings Volume 12911, Quantum Computing, Communication, and Simulation IV; 129110W (2024) https://doi.org/10.1117/12.2691176, Event: SPIE Quantum West, 2024, San Francisco, California, United States - Kleinholz, C.; Müller, B.; Fischer, M.; Dreissigacker, M.; Nallaweg, O.; Tschoban, C.; Becker, K.-F.; Schneider-Ramelow, M.; Müller. J.:
Investigation of cavity fabrication methods for integrated horn antenna structures in Low Temperature Cofired Ceramic (LTCC) substrates
Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2024), April 10-12, 2024, Osaka, Japan
(DOI: folgt) - Kleinholz; C.; Müller, B.; Fischer, M.; Tschoban, C.; Köszegi, J.-M.; Pötter, H.; Ndip, I.; Schneider-Ramelow, M.; Müller, J.:
Surface Manipulation of Ag Metallization to Improve the Adhesion Strength for Soldering Applications on LTCC
International Conference on Electronics Packaging (ICEP 2024), April 17-20, 2024, Toyama, Japan
(DOI: 10.23919/ICEP61562.2024.10535677) - Kleinholz, C.; Fischer, M.; Müller, J.:
Reliability Study of Ag through via Interconnects for Integrated Horn Antennas in LTCC Substrates
International Conference on Electronics Packaging (ICEP 2024), April 17-20, 2024, Toyama, Japan
(DOI: 10.23919/ICEP61562.2024.10535536)
