Electrodeposition of Co and Co-Cu nanowires in porous alumina substrates by pulse and pulse reverse plating. - In: Symposium Anodisieren - vom Korrosionsschutz bis zur Nanotechnologie, (2012), S. 57-63
Bonding of ceramics using reactive NanoFoil®. - In: 4th Electronic System-Integration Technology Conference (ESTC), 2012, ISBN 978-1-4673-4645-0, (2012), insges. 4 S.
A new bonding technique with reactive NanoFoils® developed by Indium Corp. was presented recently. These 40 m thick foils consist of aluminum - nickel multilayers, which react in a short but extensive exothermal heat pulse after an ignition. Additionally, these foils are sometimes covered with 5 m tin layers on each side, in order to improve bonding results. The foils act as local heat source for the bonding process. The short reaction time reduces the thermal stress to the package, what offers the possibility to join materials with different thermal expansions. In an evolutionary approach the tensile strength of the bond was tested. Therefor alumina ceramics and low temperature co-fired ceramics (LTCC) with a silver-based metallization were bonded together. The NanoFoil® was activated by an electrical discharge. Also a LTCC package with integrated activation methods was build to make allowance for the fact, that the NanoFoils® are difficult to access during the bond process. Using NanoFoils® without tin layers resulted in micro cracks within the reacted foil. The additional tin layers melted and filled the micro cracks. The bond strength of the joints was tested with good results. Additionally, the thermal performance of the bonds was investigated. Therefore, a small thermal test chip with an integrated heater was bonded on a metalized alumina using NanoFoils® with tin layers. The generated heat was measured with IR spectroscopy. To compare the thermal performance with common die attach processes the test chip was also soldered and glued on the alumina carrier. It could be shown, that the bond had a good thermal performance, which was comparable to the performance of the classic bonds.
http://dx.doi.org/10.1109/ESTC.2012.6542143
Electrodeposition of Co-Cu nanowires in alumina templates. - In: Tagungsband zum Zweiten Workshop Oberflächentechnik, ISBN 978-3-938843-72-7, (2012), S. 20-24
Glimmentladungsanalyse (GD-OES) buntgehärteter Stahloberflächen. - In: Materials testing, ISSN 0025-5300, Bd. 54 (2012), 10, S. 707-712
Comparative investigation on the determination of the austenite content in bainitic cast iron (ADI) :
Vergleichende Untersuchungen zur Bestimmung des Austenitgehalts austenitisch-ferritischen Gusseisens mit Kugelgraphit (ADI). - In: HTM - journal of heat treatment and materials, ISSN 2194-1831, Bd. 67 (2012), 6, S. 393-401
Der Austenitgehalt bestimmt maßgeblich die mechanischen und chemischen Eigenschaften von Konstruktionselementen in Eisenwerkstoffen. So werden zum Beispiel die dynamische Festigkeit und das Korrosionsverhalten von Eisenlegierungen durch den Austenitgehalt beeinflusst. Die korrekte Quantifizierung dieses Gefügebestandteils in materialwissenschaftlichen Untersuchungen, in der Produktion und auch in der Qualitätskontrolle ist somit von großer Bedeutung. Aus der Vielzahl von Verfahren werden in dieser Arbeit das Wirbelstromverfahren, die magnetinduktive Methode, die Mössbauerspektroskopie, die Metallographie sowie die Röntgenbeugung zur Untersuchung von austenitisch-ferritischem Gusseisen mit Kugelgraphit (ADI) angewendet und miteinander verglichen. Die Messergebnisse der genannten Methoden zeigen zwar alle die gleiche Tendenz im Verlauf des Austenitgehalts auf, die gemessenen Absolutwerte variieren jedoch. Da Austenit und Martensit in Schliffbildern kaum voneinander zu separieren sind, eignet sich die Metallographie bei ADI-Proben nicht zur Quantifizierung.
https://doi.org/10.3139/105.110169
Residual stress measurements and mechanical properties of AlN thin films as ultra-sensitive materials for nanoelectromechanical systems. - In: The philosophical magazine: a journal of theoretical experimental and applied physics, ISSN 1941-5869, Bd. 92 (2012), 25/27, S. 3392-3401
https://doi.org/10.1080/14786435.2012.669074
Patterned array of nanoporous silicon. - In: 23rd Micromechanics and Microsystems Europe Workshop, (2012), insges. 4 S.
Simulation, development and characterization of platinum microheater on polyimide membrane. - In: 23rd Micromechanics and Microsystems Europe Workshop, (2012), insges. 4 S.
Improved adhesion at titanium surfaces via laser-induced surface oxidation and roughening. - In: Materials science & engineering. Structural materials / American Society for Metals. - Amsterdam : Elsevier, 1988- , ISSN: 1873-4936 , ZDB-ID: 2012154-4, ISSN 1873-4936, Bd. 558 (2012), S. 755-760
http://dx.doi.org/10.1016/j.msea.2012.08.101
Ordered arrays of nanoporous gold nanoparticles. - In: Beilstein journal of nanotechnology, ISSN 2190-4286, Bd. 3 (2012), S. 651-657
http://dx.doi.org/10.3762/bjnano.3.74