Google Search
Prof. Dr.-Ing. Jens Müller
Head of the Group
Telefon: +49 3677 69-2606
Students are able to evaluate basic requirements on advanced microelectronic packages and modules and can apply their knowledge in the design of new components. They are able to identify the relationship among semiconductor
devices, packages, modules and circuit boards and can evaluate these for
specific applications.
Repetition of the basics of microelectronic packaging
Circuit board technologies
Assembly technologies
Packaging of components and modules
Packaging Roadmap
Interconnection types (FlipChip, BGA, CGA, LGA u.a.)
Multichipmodules
System-in-Packages (SiP)
System-on-Chip conceptStacked IC-technology, stacked Packages (PoP)
Chip embedding
3D-Chip-Packaging (TSV-processes)
Power-Packaging
Moulded Interconnect Device Technology
RF- and microwave packaging
MEMS-Packaging
Test and Inspection (Board, Module, AOI, X-Ray, US, ICT )
Methods of failure analysis