Ispas, Adriana;
Schlag, Leslie; Eggert, Lara; Böttcher, René; Bund, Andreas; Jacobs, Heiko O.
Electrodeposition of aluminium-nickel films in 1-butyl-1-methylpyrrolidinium-bis(trifluoromethylsulfonyl) amide. - In: Meeting abstracts, ISSN 2151-2043, Bd. MA2019-02 (2019), 17, 963
https://doi.org/10.1149/MA2019-02/17/963
Electrodeposition of aluminium-nickel films in 1-butyl-1-methylpyrrolidinium-bis(trifluoromethylsulfonyl) amide. - In: Meeting abstracts, ISSN 2151-2043, Bd. MA2019-02 (2019), 17, 963
https://doi.org/10.1149/MA2019-02/17/963
Schwarz, Felix; Bohm, Sebastian; Runge, Erich; Wang, Dong; Schaaf, Peter; Zhong, Jinhui; Yi, Juemin; Lienau, Christoph
Natural cavities with huge Purcell factors in gold nano sponges. - In: Quantum science and information technologies, (2019), FM 85.8
Natural cavities with huge Purcell factors in gold nano sponges. - In: Quantum science and information technologies, (2019), FM 85.8
Issa, Esmail;
Nagel, Henning; Guzik, Lukasz; Javanbakht, Hamed; Coron, Eddy; Rädlein, Edda; Glatthaar, Markus; Glunz, Stefan
Plated front side metallization on transparent conducting oxide utilizing low-cost APCVD SiO2 insulating layer. - In: 36th European Photovoltaic Solar Energy Conference and Exhibition, (2019), S. 431-435
Plated front side metallization on transparent conducting oxide utilizing low-cost APCVD SiO2 insulating layer. - In: 36th European Photovoltaic Solar Energy Conference and Exhibition, (2019), S. 431-435
Ulrich, Stefan; Gemse, Felix; Jahn, Simon; Schaaf, Peter
Influence of the process parameters on the transformation behaviour of 2205 Duplex Stainless Steel during laser beam welding. - In: Materials Science & Technology Conference and Exhibition 2019 (MS & T '19), (2019), S. 1018-1026
Influence of the process parameters on the transformation behaviour of 2205 Duplex Stainless Steel during laser beam welding. - In: Materials Science & Technology Conference and Exhibition 2019 (MS & T '19), (2019), S. 1018-1026
Schwager, Anne-Marie; Dellith, Jan; Bruder, Armin; Baierl, Hardy; Lasch, Patricia; Barz, Andrea; Bliedtner, Jens; Reichel, Volker; Rädlein, Edda
Hochtemperatur-Laserstrahlsintern von Glaspulverwerkstoffen. - In: 11. Mittweidaer Lasertagung, (2019), S. 181-184
Hochtemperatur-Laserstrahlsintern von Glaspulverwerkstoffen. - In: 11. Mittweidaer Lasertagung, (2019), S. 181-184
Petrich, Rebecca; Bartsch, Heike; Tonisch, Katja; Jaekel, Konrad; Barth, Stephan; Bartzsch, Hagen R.; Glöß, Daniel; Delan, Annekatrin; Krischok, Stefan; Strehle, Steffen; Hoffmann, Martin; Müller, Jens
Investigation of ScAlN for piezoelectric and ferroelectric applications. - In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), (2019), insges. 5 S.
https://doi.org/10.23919/EMPC44848.2019.8951824
Investigation of ScAlN for piezoelectric and ferroelectric applications. - In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), (2019), insges. 5 S.
https://doi.org/10.23919/EMPC44848.2019.8951824
Bartsch, Heike;
Pezoldt, Jörg; Morales Sanchez, Francico M.; Jimenez Rios, Juan J.; Mánuel Delgado, Jose M.; Breiling, Jonas; Müller, Jens
LTCC as substrate - enabling semiconductor and packaging integration. - In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), (2019), insges. 4 S.
https://doi.org/10.23919/EMPC44848.2019.8951794
LTCC as substrate - enabling semiconductor and packaging integration. - In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), (2019), insges. 4 S.
https://doi.org/10.23919/EMPC44848.2019.8951794
Pezoldt, Jörg;
Zgheib, Charbel; Stauden, Thomas; Ecke, Gernot; Kups, Thomas; Jacobs, Heiko O.; Weih, Petia
Germanium Incorporation in Silicon Carbide Epitaxial Layers Using Molecular Beam Epitaxy on 4H-SiC Substrates. - In: Silicon carbide and related materials 2018, (2019), S. 127-130
Germanium Incorporation in Silicon Carbide Epitaxial Layers Using Molecular Beam Epitaxy on 4H-SiC Substrates. - In: Silicon carbide and related materials 2018, (2019), S. 127-130
Stehr, Uwe;
Stegner, Johannes; Fischer, Michael; Gropp, Sebastian; Müller, Jens; Hoffmann, Martin; Hein, Matthias
Ganzheitliche Entwurfsmethodik für kompakte HF-MEMS-Oszillatoren auf einem SiCer-Verbundsubstrat. - In: MikroSystemTechnik Kongress 2019, (2019), S. 669-672
Ganzheitliche Entwurfsmethodik für kompakte HF-MEMS-Oszillatoren auf einem SiCer-Verbundsubstrat. - In: MikroSystemTechnik Kongress 2019, (2019), S. 669-672
Kaltwasser, Mahsa;
Karmaleevah, Kseniia; Müller, Jens
Dünnschichtstrukturierung metallorganischer Resinatpasten auf Glaswafern. - In: MikroSystemTechnik Kongress 2019, (2019), S. 607-609
Dünnschichtstrukturierung metallorganischer Resinatpasten auf Glaswafern. - In: MikroSystemTechnik Kongress 2019, (2019), S. 607-609