Process parameters affecting the bonding of in-mold decoration of injection molded components. - In: AIP conference proceedings, ISSN 1551-7616, Bd. 1779 (2016), 020008, insges. 5 S.
This paper studies the fundamental parameters affecting bonding strength of injection molded parts by an in- mold decoration process (IMD). In order to investigate the influence of materials used and a variety of processing conditions, a test mold was created for experiments. The impact of each factor was examined quantitatively by a full factorial design of experiment (DOE). The DOE covered as processing parameters melt temperature, mold temperature and packing pressure and for product related parameters film thickness and thermoplastic material. Furthermore, the temperature in the boundary layer was experimentally determined and the thermal conditions calculated with a transient simulation. In addition, the results of the experiment were compared with the simulation.
http://dx.doi.org/10.1063/1.4965459
Effects of fiber orientation on the electrical conductivity of filled plastic melt. - In: AIP conference proceedings, ISSN 1551-7616, Bd. 1779 (2016), 030007, insges. 5 S.
The substitution of conventional materials using technical plastic materials offers a high potential for integration of functions into plastics products. In this context, the light-weight design aspect as well as the simplification of complex production processes can be addressed. As an example, plastics can be modified to transfer an electrical charge by adding conductive particles. The conductivity of these plastic materials depends on the used particle system, processing parameters and part geometry. Today's simulation programs offer the possibility of forecasting fiber orientation in plastic parts as a result of processing. This work analyses the relation between simulated fiber orientation and conductivity in the plastic part. Therefore test specimen were produced on an injection molding machine with different processing parameters. Simulations were executed and the fiber orientation tensor for different processing parameters was calculated. In comparison between simulated and experimentally effected fiber orientation, the possibility of forecasting the electrical conductivity was analyzed and it could be shown that there is a good correlation.
http://dx.doi.org/10.1063/1.4965477
2D electronics - opportunities and limitations. - In: 2016 46th European Solid-State Device Research Conference (ESSDERC), ISBN 978-1-5090-2969-3, (2016), S. 230-235
http://dx.doi.org/10.1109/ESSDERC.2016.7599628
A wear model for tin surfaced contact geometries. - In: 28th International Conference on Electric Contacts, ISBN 978-0-9954659-0-9, (2016), S. 421-426
Model switch for low voltage applications. - In: 28th International Conference on Electric Contacts, ISBN 978-0-9954659-0-9, (2016), S. 105-110
The paper presents a new model switch for the investigation of the different aspects of switching arcs as well as their interaction with the involved parts of switching devices in low voltage appliances. The constructed model was designed to accomplish experimental series according to IEC 60947. Focusing as a first approach on the investigation of factors influencing the long-term behaviour of contact resistance, several experimental series combining Ag/Ni 10 contacts with different housing materials for the arc chamber walls were carried out. This paper presents the main characteristics of the constructed device and first results regarding its application with AC-arcs both from electrical and material engineering points of view.
Influence of the substrate on the morphological evolution of gold thin films during solid-state dewetting. - In: Applied surface science, Bd. 388 (2016), Part A (1. Dez.), Seite 475-482
http://dx.doi.org/10.1016/j.apsusc.2015.11.185
Only the combination of different NDT methods of material characterization is the key to success. - In: The e-journal of nondestructive testing & ultrasonics, Bd. 21 (2016), 7, WCNDT 2016, Session: Materials Characterisation, insges. 6 S.
http://nbn-resolving.de/urn:nbn:de:gbv:ilm1-2016200173
Formaldehyd- und nacharbeitsarme 3D-Hochleistungs-Holzspan-Kunststoff-Verbunde (HHKV). - In: Tagungsband des 17. Holztechnologischen Kolloquiums, (2016), S. 175-182
Concentration profile simulation of SiC/Si heterostructures. - In: Materials science forum, ISSN 1662-9752, Bd. 858 (2016), S. 501-504
http://dx.doi.org/10.4028/www.scientific.net/MSF.858.501
Heteropolytypic superlattices. - In: Materials science forum, ISSN 1662-9752, Bd. 858 (2016), S. 278-282
http://dx.doi.org/10.4028/www.scientific.net/MSF.858.278