Tagungsbeiträge

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Dimitrova, Anna; Müller, Andre; Ivanov, Svetlozar; Himmerlich, Marcel; Eisenhardt, Anja; Bund, Andreas; Krischok, Stefan
Improved electrolyte-additive induced performance of graphite anodes for lithium-ion batteries - electrochemical and electrode surface studies. - In: 79th Annual Meeting of the DPG and DPG-Frühjahrstagung (Spring Meeting) of the Condensed Matter Section (SKM) together with the Divisions: History of Physics, Gravitation and Relativity, Microprobes, Theoretical and Mathematical Physics, and Working Groups: Energy, Equal Opportunities, Information, Philosophy of Physics, Physics and Disarmament, young DPG ; March, 15 - 20, 2015, Technische Universität Berlin, 2015, CPP 37.12

Hähnlein, Bernd; Stubenrauch, Mike;
Mechanical properties and residual stress of thin 3C-SiC(100) films determined using MEMS structures. - In: Materials science forum, ISSN 1662-9752, Bd. 821/823 (2015), S. 281-284

http://dx.doi.org/10.4028/www.scientific.net/MSF.821-823.281
Fiebig, Christian; Koch, Michael
Lightweight hybrid composites of CFRP and aluminum foam. - In: Materials science forum, ISSN 1662-9752, Bd. 825/826 (2015), S. 482-489

http://dx.doi.org/10.4028/www.scientific.net/MSF.825-826.482
Hartmann, Robert; Koch, Michael
Production of 3D parts from wood chips in a closed mold process. - In: Materials science forum, ISSN 1662-9752, Bd. 825/826 (2015), S. 1027-1032

http://dx.doi.org/10.4028/www.scientific.net/MSF.825-826.1027
Gonzalez, Diego; Hopfeld, Marcus; Berger, Frank; Schaaf, Peter
Experimental switching device of the competency center for electrical contacts Ilmenau - KEKI :
Modellschalter-Versuchsstand des Kompetenzzentrums für Elektrische Kontakte - KEKI. - In: Kontaktverhalten und Schalten, (2015), S. 96-102

Düngen, Matthias; Koch, Michael;
Energy efficiency in injection molding. - In: Regional Conference Polymer Processing Society, Graz 2015, (2015), S. 63

Kazak, Oleg; Heinicke, Christiane; Wondrak, Thomas; Boeck, Thomas
Electromagnetic interaction of a small magnet and liquid metal flow in a pipe with insulating or conducting walls. - In: Magnetohydrodynamics, ISSN 0024-998X, Bd. 51 (2015), 3, S. 579-588

We study the effects of electrically conducting walls on the interaction between a permanent magnet and a liquid-metal flow in a cylindrical pipe using experiments and numerical simulation. The problem is motivated by Lorentz force velocimetry, where the drag force on the magnet due to the induced eddy currents in the flow is used for flow measurement. Compared with insulating walls, the conducting walls lead to an increased drag force on the magnet. Except for low distances, the experimental results are satisfactorily reproduced in simulations using two different approximations of the magnetic field distribution.



Endrödy, Csaba; Mehner, Hannes; Grewe, Adrian; Sinzinger, Stefan; Hoffmann, Martin
2D stepping microdrive for hyperspectral imaging. - In: Smart sensors, actuators, and MEMS VII; and cyber physical systems, 2015, 95170K, insges. 10 S.

Podoskin, Dmitry; Brückner, Klemens; Fischer, Michael; Gropp, Sebastian; Krauße, Dominik; Nowak, Jacek; Hoffmann, Martin; Müller, Jens; Sommer, Ralf
Multi-technology design of an integrated MEMS-based RF oscillator using a novel silicon-ceramic compound substrate. - In: 2015 German Microwave Conference (GeMiC), ISBN 978-1-4799-6681-3, (2015), S. 406-409

http://dx.doi.org/10.1109/GEMIC.2015.7107839
Park, Se-Chul; Fang, Jun; Biswas, Shantonu; Kaltwasser, Mahsa; Stauden, Thomas; Jacobs, Heiko O.
Automated reel-to-reel fluidic self-assembly for the production of solid state lighting modules. - In: MRS online proceedings library, ISSN 1946-4274, Bd. 1761 (2015), insges. 6 S.

We report the implementation of a first automated reel-to-reel fluidic self-assembly system based on surface tension driven self-assembly for macroelectronics application. The reported system incorporates precisely controlled and automated agitation, web moving and component recycling and dispensing system and enables continuous parallel assembly of semiconductor chips at a high rate (15k chips per hour using 2.5 cm wide web) and assembly yield (>99%) under optimal condition. In principle, scaling to any throughput should be possible considering the parallel nature of self-assembly. The process overcomes the limitations on area and throughput of prior methods. It provides a new platform for macroelectronics to enable the integration of microscopic high performance inorganic semiconductors on flexible or stretchable substrates with any desired location, pitch, and integration density. As an example we demonstrate the fabrication of a solid state area lighting panel.



https://doi.org/10.1557/opl.2015.679