Advances in "Winner" wideband MIMO system-level channel modelling. - In: European Conference on Antennas and Propagation, ISBN 978-0-86341-842-6, (2007), insges. 7 S.
UWB sensor networks for position location and imaging of objects and environments. - In: European Conference on Antennas and Propagation, ISBN 978-0-86341-842-6, (2007), insges. 9 S.
A 3-D ray tracing model for macrocell urban environments and its verification with measurements. - In: European Conference on Antennas and Propagation, ISBN 978-0-86341-842-6, (2007), insges. 6 S.
Media-push technology in multimedia mobile environment. - In: 4th IEEE Consumer Communications and Networking Conference, 2007, ISBN 978-1-4244-0667-8, (2007), S. 1182-1183
http://dx.doi.org/10.1109/CCNC.2007.243
High performance 3-dimensional hybrid-integrated switch matrix for Ka-band satellite communication applications based on ceramic multilayer technology. - In: Proceedings, (2007), S. 1-8
Enhanced model order estimation using higher-order arrays. - In: Conference record of the Forty-First Asilomar Conference on Signals, Systems and Computers, 2007, ISBN 978-1-4244-2109-1, (2007), S. 412-416
https://doi.org/10.1109/ACSSC.2007.4487242
Through-wall imaging by means of UWB radar. - In: Ultra-wideband, short-pulse electromagnetics 7, (2007), S. 613-622
Characterizing impulse radiating antennas by an intuitive approach. - In: Ultra-wideband, short-pulse electromagnetics 7, (2007), S. 334-341
Extended approaches for integrated m-sequence based UWB sensors. - In: Ultra-wideband, short-pulse electromagnetics 8, ISBN 978-0-387-73045-5, (2007), S. 135-142
LTCC multilayer technology enables very compact 20 GHz switch unit for space applications. - In: Proceedings, (2007), S. 500-504
A 4x4 switch matrix had to be realized within the project KERAMIS (Ceramic Microwave Circuits for Satellite Communications) of the German space agency DLR: This project aims at the development of innovative and inexpensive components for future applications in multimedia satellite communications. The rationale of the project is to exploit the possibility of integrating passive and active components in LTCC multilayer structures. This opens possibilities to minimize the complexity of the semiconducting components. - The working frequency of the device was in the 20 GHz band. A six layer construction with 7 conducting levels was chosen. The semiconductor switch dies were countersinked in cavities on both the top and the bottom of the circuit. The active chips were mounted using electrically conductive epoxy and wire-bonded afterwards. For testing purposes additional cavities were situated on the top side. The matrix was hermetically sealed by covers on both sides. These covers were also made in LTCC technology. Due to the complexity of the circuit 50æm lines and spaces had to be applied using fine line screen printing. The minimum distance between the edges of the cavities and the wiring was 75 æm. For cavities and vias mechanical punching and laser cutting were used. - The paper describes the technological processes and their particularities applied to manufacture this ambitious circuit.