Range-based localization for UWB sensor networks in realistic environments. - In: EURASIP journal on wireless communications and networking, ISSN 1687-1499, (2010), 476598, S. 1-9
https://doi.org/10.1155/2010/476598
Der Einfluß der Änderung der lokalen Gewebeleitfähigkeit auf das Elektroenzephalogramm und das Magnetoenzephalogramm :
The influence of local tissue conductivity changes on the magnefoencephalogram and the electroencephalogram. - In: Biomedical engineering, ISSN 1862-278X, Bd. 45 (2000), 7/8, S. 211-214
https://doi.org/10.1515/bmte.2000.45.7-8.211
Der Einfluß der Änderung der Schalenleitfähigkeit bei Randelementemodellen auf die Vorwärtsrechnung und das inverse Problem in Elektroenzephalographie und Magnetoenzephalographie :
The influence of conductivity changes in boundary element compartments on the forward and inverse problem in electroencephalography and magnetoencephalography. - In: Biomedical engineering, ISSN 1862-278X, Bd. 44 (1999), 6, S. 150-157
https://doi.org/10.1515/bmte.1999.44.6.150
New integrated UWB-sensor electronics for array-based super-resolution imaging techniques. - In: Frequenz, ISSN 2191-6349, Bd. 63 (2009), 9/10, S. 175-178
http://dx.doi.org/10.1515/FREQ.2009.63.9-10.175
Implementation of ultra-wideband sensors for biomedical applications. - In: Frequenz, ISSN 2191-6349, Bd. 63 (2009), 9/10, S. 221-224
http://dx.doi.org/10.1515/FREQ.2009.63.9-10.221
Efficient and fast method of wall parameter estimation by using UWB radar system. - In: Frequenz, ISSN 2191-6349, Bd. 63 (2009), 11/12, S. 231-235
http://dx.doi.org/10.1515/FREQ.2009.63.11-12.231
Non-coherent UWB communications. - In: Frequenz, ISSN 2191-6349, Bd. 63 (2009), 9/10, S. 187-191
http://dx.doi.org/10.1515/FREQ.2009.63.9-10.187
Extended metallization reliability testing : combining standard wafer level with product tests to increase test sensitivity. - In: Microelectronics reliability, ISSN 0026-2714, Bd. 49 (2009), 1, S. 74-78
For future semiconductor technologies with larger interconnect aspect ratios, metallization is more prone to stress and electro migration. Therefore. metallization reliability is expected to become increasingly important. However, challenges arise if test structures and test methodologies are not accommodated to trace reliability issues with sufficient sensitivity. In such cases long test times and high volume tests are required to guaranty the metallization reliability. An extended test method is presented which addresses these problems by directly investigating the product at wafer level instead of a limited set of test structures. The method will be demonstrated for the example of stress ausmigration in aluminum filled vias.
http://dx.doi.org/doi:10.1016/j.microrel.2008.10.017
Evaluation of a mutually coupled diversity receiver. - In: Radioengineering, ISSN 1210-2512, Bd. 18 (2009), 4, S. 445-453
Channel modeling for multiple satellite broadcasting systems. - In: IEEE transactions on broadcasting, ISSN 1557-9611, Bd. 55 (2009), 4, S. 705-718
http://dx.doi.org/10.1109/TBC.2009.2030464