Zeitschriftenaufsätze und Buchbeiträge

A Mix-and-Match lithography method for a high-resolution, high-precision and cost effective lithography tool using DLW and FE-SPL was developed and successfully realized. The pattern transfer from the photoresist to the silicon substrate is done by so-called "cryogenic etching". It means that the substrate is cooled down to cryogenic temperatures. In contrast to etching processes at standard room temperature, the cryogenic temperatures (below -100 ˚C) enable a highly anisotropic etching process. The difference between etching at room temperature compared to cryogenic etching is carried out in this work. The advantages of the etching process are highlighted for the pattern transfer from Mix-and-Match-structured samples. Therefore, the used photoresist mr-P 1201LIL (microresist technologies GmbH) has been examined concerning its silicon-to-resist selectivity which could be determined to be 6:1 for the applied etching recipe. Using cryogenic etching, we are now able to transfer the Mix-and-Match-structured patterns into silicon with appreciable high selectivities. This opens a novel pathway for the manufacturing of quantum devices on large wafers. The paper discusses current research results based on the TU Ilmenau Nanopositioning and Nanomeasuring Machines (NPMM) including the novel application of nanofabrication. First, the basic setup and the resulting benefits of the NPMMs for measuring and fabrication in a working volume of up to 200 mm × 200 mm × 25 mm while abiding nanometer accuracy is described. This is in contradiction to state-of-the-art AFM scanners, which have a limited working range of appr. 100 [my]m × 100 [my]m. Next, the principle and the results of different nanofabrication technologies are shown. These include Scanning Probe Lithography (SPL), Direct Laser Writing (DLW) and UV-nanoimprint lithography (NIL). Last, efforts for further improving the feature placement accuracy of the NPMMs as well as attempts to combine several fabrication technologies to improve their throughput are touched on.

Continuing engineering progress in precision fabrication technologies, especially in the semiconductor industry, precision optics fabrication, and the diversified micro- and nanotechnologies, stimulates the advance in precision metrology. Fabricated structures reach atomic dimensions in ever-larger areas, thus becoming more and more complex, also in three dimensions. Consequently, measurements are made - to an increasing extent - of larger surface regions and sidewalls with higher aspect ratios as well as fully 3D micro- and nanostructures. Advanced high precision measurement technology is more and more an enabling technology for nanotechnologies. Today, nanopositioning and nanomeasuring machines provide high-precision measurements and the positioning of objects across different scales, from subnanometers up to several centimeters. This chapter deals with the requirements for highest measurement performance at the limits of physics and technology, resulting from the progress and the goals of modern high-tech fabrication technologies. The fundamentals of the nanopositioning and nanomeasuring machine, developed at the Institute of Process Measurement and Sensor Technology of the Ilmenau University of Technology and manufactured by the SIOS Meßtechnik GmbH Ilmenau, are described, and the measurement capabilities, potential applications, progress in research, and prospects of the device for the near future are pointed out.

Progress in the field of thermoelectricity requires the further development of material science deep into the substance through the use of the achievements of applied and theoretical advances in nanotechnologies, including nanothermodynamics. This enables to expand the range of current thermodynamic forces, taking into account the forces inherent in nanostructured substances, and to increase the efficiency of attracting the concept of eddy thermoelectric currents in order to increase the accuracy of temperature measurement by thermoelectric sensors. The researches of materials of thermoelectric sensors have not only included not only the study of the stability of thermoelectric sensors, but their study by their methods of non-destructive acoustic control. This makes it possible to assess and develop the role of specific mechanisms for the formation of eddy thermoelectric currents in the drift of thermoelectric power.