Tagungsbeiträge

Anzahl der Treffer: 2032
Erstellt: Mon, 01 Jul 2024 14:29:07 +0200 in 0.0986 sec


Albrecht, Harald; Körner, Tillmann; Koch, Michael
Duroplast-Zahnräder für Zahnradpumpen. - In: Tagungsband, (2012), S. 273-290

Welker, Tilo; Grieseler, Rolf; Müller, Jens; Schaaf, Peter
Bonding of ceramics using reactive NanoFoil®. - In: 4th Electronic System-Integration Technology Conference (ESTC), 2012, ISBN 978-1-4673-4645-0, (2012), insges. 4 S.

A new bonding technique with reactive NanoFoils® developed by Indium Corp. was presented recently. These 40 m thick foils consist of aluminum - nickel multilayers, which react in a short but extensive exothermal heat pulse after an ignition. Additionally, these foils are sometimes covered with 5 m tin layers on each side, in order to improve bonding results. The foils act as local heat source for the bonding process. The short reaction time reduces the thermal stress to the package, what offers the possibility to join materials with different thermal expansions. In an evolutionary approach the tensile strength of the bond was tested. Therefor alumina ceramics and low temperature co-fired ceramics (LTCC) with a silver-based metallization were bonded together. The NanoFoil® was activated by an electrical discharge. Also a LTCC package with integrated activation methods was build to make allowance for the fact, that the NanoFoils® are difficult to access during the bond process. Using NanoFoils® without tin layers resulted in micro cracks within the reacted foil. The additional tin layers melted and filled the micro cracks. The bond strength of the joints was tested with good results. Additionally, the thermal performance of the bonds was investigated. Therefore, a small thermal test chip with an integrated heater was bonded on a metalized alumina using NanoFoils® with tin layers. The generated heat was measured with IR spectroscopy. To compare the thermal performance with common die attach processes the test chip was also soldered and glued on the alumina carrier. It could be shown, that the bond had a good thermal performance, which was comparable to the performance of the classic bonds.



http://dx.doi.org/10.1109/ESTC.2012.6542143
Weller, Jens; Wöckel, Julia; Fischer, Michael; Dzur, Birger
Der Einfluss des Substrates auf Struktur und Eigenschaften thermisch gespritzter Keramikschichten. - In: Tagungsband zum Zweiten Workshop Oberflächentechnik, ISBN 978-3-938843-72-7, (2012), S. 80-87

Mihm, Sebastian; Thomas, Georg; Dzur, Birger; Gruner, Heiko
Methode zur ganzheitlichen Prozessoptimierung des atmosphärischen Plasmaspritzens von Wärmedämmschichten. - In: Tagungsband zum Zweiten Workshop Oberflächentechnik, ISBN 978-3-938843-72-7, (2012), S. 52-63

Hahn, Sebastian; Kilian, A.; Donner, C.; Bund, Andreas
Charakterisierung einer mikrogravimetrischen Strömungszelle zum Studium transportabhängiger Reaktionen der Metallabscheidung. - In: Tagungsband zum Zweiten Workshop Oberflächentechnik, ISBN 978-3-938843-72-7, (2012), S. 34-41

Georgieva, Mihaela; Petrova, Maria; Jakob, Christine; Fritz, Mathias; Chakarova, V.
Obtaining and study of electroless composite coatings Cu-SiC and Ni-SiC on non-metallic substrates. - In: Tagungsband zum Zweiten Workshop Oberflächentechnik, ISBN 978-3-938843-72-7, (2012), S. 32

Gavril, Mihaela-Daniela; Schmidt, Udo; Gheorghies, Constantin; Ispas, Adriana; Kups, Thomas; Bund, Andreas
Electrodeposition of Co-Cu nanowires in alumina templates. - In: Tagungsband zum Zweiten Workshop Oberflächentechnik, ISBN 978-3-938843-72-7, (2012), S. 20-24

Benkenstein, Andreas; Dzur, Birger; Lippmann, Stefanie; Müller, Matthias; Wöckel, Julia
Nitrierwirkung leistungsschwacher Induktionsplasmastrahlen. - In: Tagungsband zum Zweiten Workshop Oberflächentechnik, ISBN 978-3-938843-72-7, (2012), S. 4-12

Nieland, Sabine; Neuhaus, U.; Pfaff, T.; Rädlein, Edda
New approaches for component recycling of crystalline solar modules. - In: Proceedings, (2012), S. 4645-4648

Welker, Tilo; Geiling, Thomas; Bartsch, Heike; Müller, Jens
Design and fabrication of gas tight optical windows in LTCC. - In: Proceedings, (2012), S. 000579-000583